Nearfield Instruments and the EIC Accelerator: A $1.6B Valuation
Nearfield Instruments, a spin-off of the Dutch research institute TNO based in Rotterdam and led by co-founder and chief executive Hamed Sadeghian, makes metrology and inspection machines that chipmakers use to measure structures on wafers during production, based on high-throughput atomic force microscopy. Its EIC Accelerator project, AUDIRA, "Non-Destructive Fully Automated Subsurface Metrology and Inspection for the Semiconductor Industry", receives an EU contribution of €2,496,499 and ran from November 2024 to April 2026, according to CORDIS. It aimed to take AUDIRA, a machine that measures features buried under opaque wafer layers by "listening" to sound waves with an AFM probe, from technology readiness level 5 to 8.
In its application, Nearfield described itself as "the only European organization offering advanced metrology and inspection solutions" for chipmakers, with more than 160 staff, 71 patents and commercial relationships with Samsung, Intel and TSMC, and forecast break-even in 2026. Three days after the EIC selection, in July 2024, it closed a €135 million Series C led by Walden Catalyst and Temasek, according to Nearfield Instruments. In June 2026 it raised $380 million at a $1.6 billion valuation, led by Fidelity, with the Qatar Investment Authority joining, the largest deep-tech round in the Netherlands, according to Nearfield Instruments.
Company file
- Legal entity
- Nearfield Instruments B.V., Rotterdam
- Origin
- Spin-off of TNO
- CEO
- Hamed Sadeghian, co-founder
- Chairman
- Eric Meurice, former CEO of ASML
- Products
- QUADRA (in production fabs), AUDIRA (subsurface)
- Investors
- Fidelity, Temasek, Walden Catalyst, M&G, Innovation Industries, Invest-NL, QIA, TNO Ventures, ING
- EIC funding
- Blended finance, €2.5M grant
Where Nearfield Stands Now
Nearfield's business runs on QUADRA, a 3D metrology system that it says was "fully integrated into the first major high-volume semiconductor manufacturing fab" by July 2024. In December 2024 it announced repeat QUADRA orders from a leading chipmaker that filled its 2025 order book, according to Nearfield Instruments. It has offices in Japan, South Korea, the US, Singapore and Taiwan. The Series D will fund application centres, production capacity and customer support. Its Dutch accounts were not accessible in free sources.
The record
From TNO spin-off to $1.6B chip metrology company
Nearfield's growth rests on QUADRA, its first metrology system. AUDIRA, the subsurface tool the EIC funded, was launched in 2023; no AUDIRA orders have been announced.
- Jul 2023AUDIRA launchedSubsurface metrology system
- Mar 2024EIC Accelerator cut-offAUDIRAblended finance
- Jul 2024€135M Series CWalden Catalyst, Temasek; QUADRA in high-volume fab
- Nov 2024EIC project starts€2.5M EU contribution
- Dec 2024QUADRA repeat orders2025 order book full
- Apr 2026EIC project closesNo public results report
- Jun 2026$380M Series DFidelity lead; $1.6B valuation
Nearfield Instruments and CORDIS.
"This highly successful funding round marks a defining moment in our journey."
Hamed Sadeghian, co-founder and CEO, June 2026The Technology: Listening Through a Wafer
AUDIRA combines an acoustic microscopy technique with Nearfield's AFM: the probe picks up sound waves reflected from layers inside the chip, revealing buried features and defects such as voids without cutting the wafer, according to Nearfield's July 2023 launch announcement. The company said it would complement transmission and scanning electron microscopy for process control. AUDIRA had been launched as a product eight months before the EIC cut-off.
The IP
Nearfield's patent portfolio at application
Nearfield told the EIC it held 71 patents: 29 of its own and 42 licensed from TNO, the Dutch research institute it spun out of.
CORDIS project objective. Patents.
What the EIC Award Promised, and What the Record Shows
The project closed in April 2026, but CORDIS shows no results report, and Nearfield has not announced an AUDIRA customer, order or production milestone. Its 2026 Series D release names QUADRA's markets and new architectures but not AUDIRA. Whether AUDIRA reached TRL 8 cannot be checked.
- AUDIRA to TRL 8UnverifiedNo report.
- AUDIRA customersNone announcedCompany news.
- Company growthStrong$380M Series D.
- Break-even in 2026UnverifiedNo accounts.
The Money
Nearfield raised €135 million and $380 million in its two most recent rounds. The EIC grant of €2.5 million is under 2% of the Series C alone. No EIC Fund investment has been announced. The case raises a question about additionality: whether a company that was simultaneously closing a nine-figure round needed the EIC's scarce grant money.
The funding
Recent rounds and the EIC grant, millions
The EIC grant is small next to Nearfield's private rounds: €135 million in 2024 and $380 million in 2026.
Nearfield Instruments and CORDIS. Millions, in the currency announced.
What Cannot Be Checked
Questions for the EIC
Why the EIC funded a company raising €135 million in the same month, whether the EIC Fund invested, what AUDIRA achieved during the project, and whether Nearfield reached break-even in 2026 are not public.
Why Europe Should Care
Nearfield calls itself the only European player in advanced metrology and inspection. A strong Dutch supplier next to ASML matters for Europe's chip ambitions. That is an argument for its investors, who have backed it heavily, more than for a small EIC grant.
What the award promised
A mature, fully automated subsurface metrology machine at TRL 8.
What the record shows
A booming QUADRA business, no public AUDIRA results.
The Verdict
Success story, unclear grant
Nearfield is one of Europe's deep-tech winners. What €2.5 million of EIC money added is not on the record.
Nearfield Instruments and the EIC have not been asked for comment for this article. It is based entirely on public records and published statements, linked throughout.
Industry
Electronics and semiconductorsSemiconductors
- Focus
- Semiconductor manufacturing equipment
- Technologies
- Microscopy
- Acoustic engineering
- Keywords
- Wafer metrology
- Subsurface inspection
- Chip manufacturing
- Defect detection
- Atomic force microscopy
- Acoustic imaging